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a62s7308b series preliminary 128k x 8 bit low voltage cmos sram preliminary (march, 2001, version 0.2) amic technology, inc. document title 128k x 8 bit low voltage cmos sram revision history rev. no. history issue date remark 0.0 initial issue september 5, 2000 preliminary 0.1 change max. power supply voltage from 3.3v to 3.6v october 12, 2000 change min. v ih from 2.2v to 2.4v add feature ? interfaces directly with 3.3v typ. logic chip? remove a62s7308b - 10s/si part 0.2 add a62s7308b - 55s/si part march 9, 2001 change input pulse levels from 0.4v~2.4v to 0v~3.0v in ac test conditions table
a62s7308b series preliminary 128k x 8 bit low voltage cmos sram preliminary (march, 2001, version 0.2) 1 amic technology, inc. nc a14 a12 a7 a6 a5 a4 a3 a2 a1 a0 i/o 0 i/o 1 i/o 2 i/o 3 gnd i/o 4 i/o 5 i/o 6 i/o 7 a10 a9 a8 a13 ce2 a15 vcc a11 a62s7308bm 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 oe ce1 we a10 7 6 5 4 3 gnd oe ce1 2 1 0 a16 a62s7308bv (a62s7308bx) 1 9 32 24 a11 a9 2 3 4 5 6 7 8 10 11 12 13 14 15 16 a8 a13 vcc nc a14 a12 a7 a6 a5 a4 31 30 29 28 27 26 25 23 22 21 20 19 18 17 i/o i/o i/o i/o i/o a0 a1 a2 a3 a15 we ce2 i/o i/o i/o ~ ~ ~ ~ a16 1 2 3 4 5 6 a a0 a1 ce2 a3 a6 a8 b i/o 4 a2 we a4 a7 i/o 0 c i/o 5 nc a5 i/o 1 d vss vcc e vcc vss f i/o 6 nc nc i/o 2 g i/o 7 oe ce1 a16 a15 i/o 3 h a9 a10 a11 a12 a13 a14 features n power sup ply range: 2.7v to 3.6v n access times: 55ns (max.): for vcc = 3.0v to 3.6v 70ns (max.): for vcc = 2.7v to 3.6v n current: a62s7308b - s series: operating: 30ma (max.) standby: 5 m a (max.) a62s7308b - si series: operating: 30ma (max.) standb y: 10 m a (max.) n extended operating temperature range: - 25 c to 85 c for - si series n full static operation, no clock or refreshing required n all inputs and outputs are directly ttl compatible n common i/o using three - state output n output enable and two chip enable inputs for easy application n data retention voltage: 2v (min.) n available in 32 - pin sop, tsop, stsop (8x 13.4mm) forward type and 36 - ball mini bga (6x8) packages n interfaces directly with 3.3v typ. logic chip general description the a62s 7308b is a low operating current 1048,576 - bit static random access memory organized as 131,072 words by 8 bits and operates on a low power supply voltage from 2.7v to 3.6v. inputs and three - state outputs are ttl compatible and allow for direct interfacing with common system bus structures. two chip enable inputs are provided for power down and a device enable and an output enable input are included for easy interfacing. data retention is guaranteed at a power supply voltage as low as 2v. pin configurations n n sop n n tsop/(stsop) n n mini bga (6x8) top view (forward type)
a62s7308b series preliminary (march, 2001, version 0.2) 2 amic technology, inc. block diagram row decoder 512 x 2048 memory array input data circuit column i/o control circuit ce2 ce1 we i/o 7 i/o 0 a16 a15 a14 a0 vcc gnd oe pin descriptions - sop pin no. symbol description 1 nc no connection 2 - 12, 23, 25 - 28, 31 a0 - a16 address inputs 13 - 15 , 17 - 21 i/o 0 - i/o 7 data inputs/outputs 16 gnd ground 22 ce1 chip enable 1 24 oe output enable 29 we write enable 30 ce2 chip enable 2 32 vcc power supply pin description - tsop/stso p pin no. symbol description 1 - 4, 7, 10 - 20, 31 a0 - a16 address inputs 5 we write enable 6 ce2 chip enable 2 8 vcc power supply 9 nc no connection 21 - 23, 25 - 29 i/o 0 - i/o 7 data inputs/outputs 24 gnd ground 30 ce1 chip enable 1 32 oe output enable
a62s7308b series preliminary (march, 2001, version 0.2) 3 amic technology, inc. recommended dc operating conditions (t a = 0 c to + 70 c or - 25 c to 85 c) symbol parameter min. typ. max. unit vcc supply voltage 2.7 3.0 3.6 v gnd ground 0 0 0 v v ih input hig h voltage 2.4 - vcc + 0.3 v v il input low voltage - 0.3 - +0.6 v c l output load - - 30 pf ttl output load - - 1 - absolute maximum ratings* vcc to gnd . . . . . . . . . . . . . . . . . . . . . - 0.5v to + 4.6v in, in/out volt to gnd . . . . . . . . . - 0.5v to vcc + 0.5v operating temperature, topr . . . . . . . . - 25 c to + 85 c storage temperature, tstg . .. . . . . . . . - 55 c to + 125 c power dissipation, p t . . . . . . . . . . . . . . . . . . . . . . 0.7w soldering temp. & time . . . . . . . . . . . . . 260 c, 10 sec *comments stresses above those listed under "absolute maximum ratings" may cause permanent damage to this device. these are stress ratings only. functional operation of this device at these or any other conditions above those indi cated in the operational sections of this specification is not implied or intended. exposure to the absolute maximum rating conditions for extended periods may affect device reliability. dc electrical characteristics (t a = 0 c to + 70 c or - 25 c to 85 c, vcc = 2.7v to 3.6v, gnd = 0v) symbol parameter a62s7308b - 55s/70s a62s7308b - 55si/70si unit conditions min. max. min. max. ? i li input leakage current - 1 - 1 m a v in = gnd to vcc ? i lo output leakage current - 1 - 1 m a ce1 = v ih or ce2 = v il or oe = v ih or we = v il v i/o = gnd to vcc i cc active power supply current - 3 - 3 ma ce1 = v il , ce2 = v ih i i/o = 0ma i cc1 dynamic operating current - 30 - 30 ma min. cycle, duty = 100% ce1 = v il , ce2 = v ih i i/o = 0ma i cc2 dynamic operating current - 3 - 3 ma ce1 = v il , ce2 = v ih v ih = vcc , v il = 0v f = 1mhz, i i/o = 0ma
a62s7308b series preliminary (march, 2001, version 0.2) 4 amic technology, inc. { dc electrical characteristics (continued) symbol parameter a62s7308b - 55s/70s a62s7308b - 55si/70si unit conditions min. max. min. max. i sb - 0.3 - 0.3 ma ce1 = v ih or ce2 = v il i sb1 standby power supply current - 5 - 10 m a ce2 0.2v, or ce1 3 vcc - 0.2v ce2 3 vcc - 0.2v v ol output low voltage - 0.4 - 0.4 v i ol = 2.1ma v oh output high voltage 2.4 - 2.4 - v i oh = - 1.0ma truth table mode ce1 ce2 oe we i/o operation supply current standby h x x x high z i sb , i sb1 x l x x high z i sb , i sb1 output disable l h h h high z i cc, i cc1, i cc2 read l h l h d out i cc, i cc1, i cc2 write l h x l d in i cc, i cc1, i cc2 n ote: x = h or l capacitance (t a = 25 c, f = 1.0mhz) symbol parameter min. max. unit conditions c in * input capacitance 6 pf v in = 0v c i/o * input/output capacitance 8 pf v i/o = 0v * these parameters are sampled and not 100% tested.
a62s7308b series preliminary (march, 2001, version 0.2) 5 amic technology, inc. ac characteristic s (t a = 0 c to + 70 c or - 25 c to 85 c) symbol parameter a62s7308b - 55s/si (vcc = 3.0v to 3.6v) a62s7308b - 70s/si (vcc = 2.7v to 3.6v) unit min. max. min. max. read cycle t rc read cycle time 55 - 70 - ns t aa address access time - 55 - 70 ns t ace1 chip enable access time ce1 - 55 - 70 ns t ace2 ce2 - 55 - 70 ns t oe output enable to output valid - 30 - 35 ns t clz1 chip enable to output in low z ce1 10 - 10 - ns t clz2 ce2 10 - 10 - ns t olz output enable to output in low z 10 - 5 - ns t chz1 chip disable to output in high z ce1 0 20 0 25 ns t chz2 ce2 0 20 0 25 ns t ohz output disable to output in high z 0 20 0 25 ns t oh output hold from address change 5 - 10 - ns write cycle t wc writ e cycle time 55 - 70 - ns t cw chip enable to end of write 50 - 60 - ns t as address setup time 0 - 0 - ns t aw address valid to end of write 50 - 60 - ns t wp write pulse width 40 - 50 - ns t wr write recovery time 0 - 0 - ns t whz write to output in hig h z 0 25 0 30 ns t dw data to write time overlap 25 - 30 - ns t dh data hold from write time 0 - 0 - ns t ow output active from end of write 5 - 5 - ns notes: t chz1 , t chz2 , t ohz and t whz are defined as the time at which the outputs achieve the open circui t condition and are not referred to output voltage levels.
a62s7308b series preliminary (march, 2001, version 0.2) 6 amic technology, inc. timing waveforms read cycle 1 (1) t rc address ce2 d out t aa t oe t olz 5 t ace1 t clz1 5 t ace2 t clz2 5 t chz2 5 t ohz 5 t chz1 5 t oh oe ce1 read cycle 2 (1, 2, 4) t rc t oh t aa t oh address d out
a62s7308b series preliminary (march, 2001, version 0.2) 7 amic technology, inc. timing waveforms (continued) read cycle 3 (1, 3, 4, 6) t clz1 5 t ace1 t chz1 5 ce1 d out read cycle 4 (1, 4, 7, 8) t clz2 5 t ace2 t chz2 5 ce2 d out notes: 1. we is high for read cycle. 2. device is continuously enabled ce1 = v il and ce2 = v ih . 3. address valid prior to or coincident w ith ce1 transition low. 4. oe = v il . 5. transition is measured 500mv from steady state. this parameter is sampled and not 100% tested. 6. ce2 is high. 7. ce1 is low. 8. address valid pri or to or coincident with ce2 transition high.
a62s7308b series preliminary (march, 2001, version 0.2) 8 amic technology, inc. timing waveforms (continued) write cycle 1 (6) (write enable controlled) t wc address ce1 ce2 d in t ow t dh t dw t whz t wp 2 t as 1 (4) t cw 5 t aw t wr 3 we d out (4)
a62s7308b series preliminary (march, 2001, version 0.2) 9 amic technology, inc. timing waveforms (continued) write cycle 2 (6) (chip enable controlled) t wc address ce1 ce2 d in t dh t dw (4) (4) t cw 5 t aw t wr 3 we d out t whz 7 t wp 2 t cw 5 t as 1 no tes: 1. t as is measured from the address valid to the beginning of write. 2. a write occurs during the overlap (t wp ) of a low ce1 , a high ce2 and a low we . 3. t wr is measured from the earliest of ce1 or we going high or ce2 going low to the end of the write cycle. 4. if the ce1 low transition or the ce2 high transition occurs simultaneously with the we low transition or after the we transition, outputs remain in a high impedance state. 5. t cw is measured from the later of ce1 going low or ce2 going high to the end of write. 6. oe is continuously low. ( oe = v il ) 7. transition is measured 500mv from steady state. this parameter is sampled and not 100% tested.
a62s7308b series preliminary (march, 2001, version 0.2) 10 amic technology, inc. { { ac test conditions input pulse levels 0v to 3v input rise and fall time 5 ns input and output timing reference levels 1.5v output lo ad see figures 1 and 2 30pf * including scope and jig. * including scope and jig. c l ttl 5pf c l ttl figure 1. output load figure 2. output load for t clz1 , t clz2 , t ohz , t olz , t chz1 , t chz2 , t whz , and t ow data retention characteristics (t a = 0 c to + 70 c or - 25 c to 85 c) symbol parameter min. max. unit conditions v dr vcc for data retention 2.0 3.6 v ce2 0.2v, or ce1 3 vcc - 0.2v, ce2 3 vcc - 0.2v i ccdr data retention current s - version - 2* m a si - version - 5** vcc = 2.0v, ce2 0.2v, or ce1 3 vcc - 0.2v ce2 3 vcc - 0.2v t cdr chip disable to data retention time 0 - ns t r operation recovery time t rc - ns see retention waveform * a62s7308b - 55s/70s i ccdr : max. 1 m a at t a = 0 c to + 40 c ** a62s7308b - 55si/70 si i ccdr : max. 1 m a at t a = 0 c to + 40 c
a62s7308b series preliminary (march, 2001, version 0.2) 11 amic technology, inc. low vcc data retention waveform (1) ( ce1 controlled) vcc ce1 t cdr v ih 2.7v t r v ih 2.7v data retention mode v dr 3 2v ce1 3 v dr - 0.2v low vcc data retention waveform (2) (ce2 controlled) vcc ce2 t cdr v il 2.7v t r v il 2.7v data retention mode v dr 3 2v ce2 0.2v
a62s7308b series preliminary (march, 2001, version 0.2) 12 amic technology, inc. ordering information part no. access time (ns) operating current max. (ma) standby current max. ( m m a) package a62s7308bm - 55s 5 32l sop a62s7308bm - 55si 10 32l sop a62s7308bv - 55s 5 32l tsop a62s7308bv - 55si 10 32l tsop a62s7308bx - 55s 5 32l stsop a62s7308bx - 55si 10 32l stsop a62s7308bg - 55s 5 36b mini bga a62s7308bg - 55si 55 30 10 36b mini bga a62s7308bm - 70s 5 32l sop a62s7308bm - 70si 10 32l sop a62s7308bv - 70s 5 32l tsop a62s7308bv - 70si 10 32l tsop a62s7308bx - 70s 5 32l stsop a62s7308bx - 70si 10 3 2l stsop a62s7308bg - 70s 5 36b mini bga a62s7308bg - 70si 70 30 10 36b mini bga
a62s7308b series preliminary (march, 2001, version 0.2) 13 amic technology, inc. package information sop (w.b.) 32l outline dimensions unit: inches/mm 1 e h e l l e c 16 see detail f detail f 17 32 a 1 a 2 a s d seating plane d y e b q dimensions in inches dimensions in mm symbol min nom max min nom max a - - 0.118 - - 3.00 a 1 0.004 - - 0.10 - - a 2 0.101 0.106 0.111 2.57 2.69 2.82 b 0.014 0.016 0.020 0.36 0.41 0.51 c 0.006 0.008 0.012 0.15 0.20 0.31 d - 0.805 0.817 - 20.45 20.75 e 0.440 0.445 0.450 11.18 11.30 11.43 e 0.044 0.050 0.056 1.12 1.27 1.42 h e 0.546 0.556 0.566 13.87 14.12 14.38 l 0.023 0.031 0.039 0.58 0.79 0.99 l e 0.047 0.055 0.063 1.19 1.40 1.60 s - - 0.036 - - 0.91 y - - 0.004 - - 0.10 q 0 - 10 0 - 10 notes: 1. the maximum value of dimension d includes end flash. 2. dimension e does not include resin fins. 3. dimension s includes end flash.
a62s7308b series preliminary (march, 2001, version 0.2) 14 amic technology, inc. package information tsop 32l type i (8 x 20mm) outline dimensions unit: inches/mm e l e l a a 2 c d y detail "a" s a 1 b h d d e q detail "a" dimensions in inches dimensions in mm symbol min nom max min nom max a - - 0.047 - - 1.20 a 1 0.002 - 0.006 0.05 - 0.15 a 2 0.037 0.039 0.041 0.95 1.00 1.05 b 0.007 0.009 0.011 0.18 0.22 0.27 c 0.004 - 0.008 0.11 - 0.20 d 0.720 0.724 0.728 18.30 18.40 18.50 e - 0.315 0.319 - 8.00 8.10 e 0.020 bsc 0.50 bsc h d 0.779 0.787 0.795 19.80 20.00 20.20 l 0.016 0.020 0.024 0.40 0.50 0.60 l e - 0.032 - - 0.80 - s - - 0.020 - - 0.50 y - - 0.003 - - 0.08 q 0 - 5 0 - 5 notes: 1. the maximum value of dimension d includes end flash. 2. dimension e does not include resin fins. 3 . dimension s includes end flash.
a62s7308b series preliminary (march, 2001, version 0.2) 15 amic technology, inc. package information stsop 32l type i (8 x 13.4mm) outline dimensions unit: inches/mm e detail "a" d 0.076mm detail "a" s b d 1 e d l e l a a 2 c q a 1 seating plane dimensions in inches dimensions in mm symbol min nom max min nom max a - - 0.049 - - 1.25 a 1 0.00 2 - - 0.05 - - a 2 0.037 0.039 0.041 0.95 1.00 1.05 b 0.007 0.008 0.009 0.17 0.20 0.23 c 0.0056 0.0059 0.0062 0.142 0.150 0.158 e 0.311 0.315 0.319 7.90 8.00 8.10 e 0.020 typ 0.50 typ d 0.520 0.528 0.535 13.20 13.40 13.60 d 1 0.461 0.465 0.469 11.70 11.80 11.90 l 0.012 0.020 0.028 0.30 0.50 0.70 l e 0.0275 0.0315 0.0355 0.700 0.800 0.900 s 0.0109 typ 0.278 typ q 0 3 5 0 3 5 notes: 1. the maximum value of dimension d 1 includes end flash. 2. dimension e does not include resin fins. 3. dimensio n s includes end flash.
a62s7308b series preliminary (march, 2001, version 0.2) 16 amic technology, inc. package information mini bga 6x8 (36 balls) outline dimensions unit : millimeter(mm) symbol min typ max a - 0.75 - b 5.90 6.00 6.10 b1 - 3.75 - c 7.90 8.00 8.10 c1 - 5.25 - d 0.30 0.35 0.40 e 1.00 1.10 1.20 e1 - 0.36 - e2 - 0.22 - 1 2 3 4 5 6 a b c d e f g h bottom view pin a1 index diameter d solder ball a b1 a c1 top view pin a1 index b c 0.10 e1 e e2 d

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